The manufacturing capability of the cleanroom concentrates on die placement and interconnecting.
At the core of the die placement process is the Datacon PPS2210 die handling robot, which has a die placement accuracy of ±25µm (6 Sigma) at a rate of 2000 placements per hour depending on the application.
In addition epoxy placement can be achieved by epoxy stamping, epoxy dispense using either pressure and time or a volumetric controlled dispenser.
Die presentation can be either in waffle packs, Gel-paks, and 6 inch wafer rings for die eject down to 280 x 280µm.
Interconnection is by using fine gold or aluminium wire and gold tape bonding.
We have a manual Hybond 572A-40 wedge bonder and two K&S 4523A semi-automatic wedge bonders with an additional K&S 4122 ball bonder modified for stud bumping
