Alps Electric (UK) Ltd - Microcircuit, Hybrids, RF Modules, CEM, Hybrid Circuits, Chip On Board, Design Assembly

Advanced Manufacturing				Page 1/2/3/4 NEXT
We specialise in gold tape bonding (63microns wide and 12.5microns thick) for high frequency applications. Tape bonding is more effective than multiple fine wire bonds, as the the tape bonding has low inductance at frequencies of 20 GHz and above.
	We also are able to wedge bond interconnects using 17.5 µm and 25µm diameter gold wire. Where the product is temperature sensitive , we are able to use 25µm diameter aluminium wire.
To enhance the bondability of surfaces, we are able to Argon Plasma clean the die and circuit surfaces. However this process is normally carried out if there is a trace of organic contamination on the wire or tape bonding pads
For quality control we sample test the quality of the die attach process by die shearing components to MIL-STD 883 method 2019.5 standards on a Dage 4000 wire bond pull and die shear tester. Like wise we are able to carry out wire bonding pull tests to verify the process capability of the wire or tape bonding process again to MIL-STD 883 method 2011.7. In addition to the above equipments we have: 3 Leica MZ6 stereo microscopes (16x to 100X) Leica MZ6 dual training microscope (16X to 100X). Leica DMLN stereo microscope (50X to 1000X)
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